techniques: Other Micro/Nanofab

SHyNE facilities offer a range of back-end, packaging and other cleanroom capabilities. These include thermal annealing, wire bonding, dicing and other techniques.

CRITICAL POINT DRYING

To preserve fragile structures after wet etching processes, CPD can be used to dry the sample without the potential damage caused by surface tension of the liquid. This is particularly useful when releasing MEMS devices with suspended structures.

 Our current range of CPD tools can be found in our NUFAB and PNF Facilities.

THERMAL PROCESSING

Thermal processing can be used to relieve stresses produced by other processing steps. Our facilities offer both rapid thermal processing and standard furnaces.

Our current range of thermal processing tools can be found in our NUFAB Facility.

WAFER DICING

To separate wafers into individual die, our facilities offer standard dicing saws in addition to advanced laser dicing capabilities.

Our current range of wafer dicing tools can be found in our NUFAB and PNF Facilities.

PACKAGING

Our facilities offer packaging capabilities for your finished devices, specifically vacuum packaging.

Our current range of packaging tools can be found at the PNF Facility.

WIRE BONDING

To make electrical connection to your devices, our facilities offer different types of wire bonding including wedge bonding and ball bonding.

Our current range of wire bonding tools can be found in the NUFAB and PNF Facilities.

Nasir Basit, PhD

Nasir Basit, PhD

NUFAB Director of Operations

Office: Tech FG73 
(847) 467-6201 / email

Peter Duda

Peter Duda

Technical Director, PNF

Pritzker Nanofabrication Facility
William Eckhardt Research Center (ERC)
5640 S. Ellis Ave., Lower Level 1
Chicago, IL 60637
 (773) 834-3548 / email