techniques: Etching
Etching is a process by which undesired material is removed from the target sample. At our facilities, we offer a number of methods to help users achieve this important fabrication process.
REACTIVE ION ETCHING (REI)
Reactive ion etching (RIE) involves the use of ions in a plasma that chemically react with and remove a wide variety of semiconducting or insulating materials. Our facilities offer a number of different RIE tools to best match users’ needs.
Our current range of RIE setups can be found in our NUFAB and PNF Facilities.
VAPOR ETCHING
Vapor etching is a dry etching process that involves the use of gas molecules to etch undesired material through a chemical process. This methodology is quite effective in removing regions of semiconducting or insulating materials from undesired regions and is a common microfabrication technique.
Our current range of vapor etching setups can be found in our NUFAB Facility.
PLASMA ETCHING
Plasma etching involves the use of a plasma to convert the material to be removed from a solid phase to a gaseous phase that can be purged from the system. This valuable microfabrication tool allows for removal of hydrocarbon species from the target sample.
Our current range of Plasma etching setups can be found in our NUFAB and PNF Facilities.
WET ETCHING
