services: Thin Film Deposition
Whether you need to deposit films as part of a comprehensive device fabrication or just need a functional coating for a given application, we likely have the capabilities you need. From chemical and physical vapor deposition processes to advanced atomic layer deposition, we can handle a wide range of materials and substrates.
RELEVANT TECHNIQUES:
PHYSICAL VAPOR DEPOSITION (PVD)
Physical vapor deposition (PVD) is a class of deposition techniques that involves first vaporizing the material of interest, followed by condensation of the material on the target sample. Our facilities offer a number of PVD tools that are useful for depositing material for a variety of applications, such as semiconductors, automobiles, and jewelry.
Our current range of PVD setups can be found in our NUFAB Facility and the Pritzker Nanofabrication Facility.
Additional PVD setups are available in the GIANTFab core facility at Northwestern.
CHEMICAL VAPOR DEPOSITION (CVD)
Chemical vapor deposition (CVD) is a vacuum deposition process that involves depositing high quality material on a target sample through the use of a chemical reaction. Our facilities offer the ability to deposit a variety of films through this process including silicon and various dielectric materials for semiconductor applications.
Our current range of CVD setups can be found in our NUFAB Facility and the Pritzker Nanofabrication Facility.
ATOMIC LAYER DEPOSITION (ALD)
Atomic layer deposition (ALD) is a specialized, highly controllable deposition process that we offer in our facilities. This technique allows for sequential, layer-by-layer deposition of a variety of materials. The highly controllable nature of this process allows for precise tuning of the deposited material’s thickness, which makes it quite appealing for fabricating semiconductor devices.
Our current range of CVD setups can be found in our NUFAB Facility and the Pritzker Nanofabrication Facility.